| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_af4cc10d515454e59278de7445531247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e7b8eb8e7952632ca7ca406e4fbd7b84 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76254 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-762
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate |
2018-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ebc55d62390c9d95d9360966c085914
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb24e4ee4ff95451fb4c3742fe2fb487
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6ea07378f4c9acc3c23e21d04a60561
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca92711129f39af841394a2de4fefb03 |
| publicationDate |
2020-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10811307-B2 |
| titleOfInvention |
Polishing slurries for polishing semiconductor wafers |
| abstract |
Polishing slurries for polishing semiconductor substrates are disclosed. The polishing slurry may include first and second sets of colloidal silica particles with the second set having a silica content greater than the first set. |
| priorityDate |
2015-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |