| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8ffba2d609b4a47b8cb21df9a838961c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9700c62f6d707abed42113848dd9a4e9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_00752e0690a82d0747d695964fbc7345 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1089
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76867
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76864
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76868
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 |
| filingDate |
2009-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2012-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc2c3a5ce5ba42cdfcd59ea1ab7e4131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2eada4ffde31e3ee4322f47fbe5ad94e |
| publicationDate |
2012-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8324730-B2 |
| titleOfInvention |
Copper interconnection structure and method for forming copper interconnections |
| abstract |
A copper interconnection structure includes an insulating layer, an interconnection body including copper in an opening provided on the insulating layer, and a diffusion barrier layer formed between the insulating layer and the interconnection body. The diffusion barrier layer includes an oxide layer including manganese having a compositional ratio of oxygen to manganese (y/x) less than 2. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11362079-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016307796-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9953926-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10665542-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020251626-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11682639-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9991203-B2 |
| priorityDate |
2008-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |