Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1e3d8364bf64e4ac6e1a9cd5df2bd54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8733ede0de158ed364160b0fa51458d0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_52c15c18cb6e67eab2f33b9fda006c98 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-34 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
filingDate |
2007-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2012-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d47c459e7a5381b4ebaf485807c08a5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_750c89fdb022926f2ec820cda733048c |
publicationDate |
2012-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8323990-B2 |
titleOfInvention |
Reliability test structure for multilevel interconnect |
abstract |
Embodiments in accordance with the present invention relate to structures and methods allowing stress-induced electromigration to be tested in multiple interconnect metallization layers. An embodiment of a testing structure in accordance with the present invention comprises at least two segments of a different metal layer through via structures. Each segment includes nodes configured to receive force and sense voltages. Selective application of force and sense voltages to these nodes allows rapid and precise detection of stress-induced immigration in each of the metal layers. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011074459-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9851397-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9476927-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11099230-B2 |
priorityDate |
2006-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |