| abstract |
An LTCC substrate structure with at least one contact element for connecting a wire conductor, which has a first metallization ( 20 ) arranged on and/or in the ceramic substrate for electrical connection to the wire conductor, wherein the first metallization ( 20 ) preferably contains silver or a silver alloy. To avoid via posting or a plating process, a diffusion barrier layer covering the first metallization or metal layer, which diffusion barrier layer ( 22 ) covering the first metallization ( 20 ), which diffusion barrier layer is produced with a locally acting application method, and a second metal layer ( 24 ) arranged on the diffusion barrier layer ( 22 ) are provided, wherein the second metal layer ( 24 ) preferably contains gold and/or platinum and/or an alloy that has at least one of these elements. The invention also discloses a production method for an LTCC substrate structure of this type. |