| abstract |
An architecture and method of fabrication for an integratedncircuit having a bond pad; at lest one portion of saidnintegrated circuit disposed under said contact pad andnelectrically connected to said pad through a via; a combinationnof a bondable metal layer, a stress-absorbing metal layer, and anmechanically strengthened, electrically insulating layer; andnsaid combination of layers separating said contact pad and saidnportion of said integrated circuit, and having sufficientnthickness to protect said circuit from bonding impact. |