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filingDate 2007-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2011-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2011-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8048725-B2
titleOfInvention Method of forming pattern and method of producing electronic element
abstract A method of forming a pattern and a method of producing an electronic element are characterized by including a first step of forming an electrically conductive film (D) by applying a liquid composition onto a first plate ( 10 ), and heating the first plate ( 10 ); a second step of forming an electrically conductive pattern (D′) on the first plate ( 10 ) by pressing a second plate ( 20 ) having a projection-and-recess pattern on a surface side thereof onto a surface side of the first plate ( 10 ), on which the electrically conductive film (D) is formed, to transfer an unwanted pattern of the electrically conductive film (D) to top faces of projections ( 20 a ) of the second plate ( 20 ), thereby removing the unwanted pattern; and a third step of transferring the electrically conductive pattern (D′) to a surface of a transfer-receiving substrate ( 30 ) by pressing the surface side of the first plate ( 10 ), on which the electrically conductive pattern (D′) is formed, onto the surface of the transfer-receiving substrate ( 30 ), wherein the liquid composition contains a solvent having a vapor pressure of 133 Pa or less at a surface temperature of the heated first plate ( 10 ). These methods provide a method of forming a pattern and a method of producing an electronic element in which a state of a liquid-composition coating film is stabilized and a fine and precise pattern can be stably formed with good reproducibility.
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