| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-113
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3457
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-388 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2005-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2011-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ae4bdb00d5faed162c46f66933d3d1e |
| publicationDate |
2011-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7993510-B2 |
| titleOfInvention |
Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board |
| abstract |
The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in approximately the same plane at the time of manufacturing a multilayer printed circuit board. The electroplating solution of the present invention is characterized by containing 50 to 300 g/L of copper sulfate, 30 to 200 g/L of sulfuric acid, 25 to 90 mg/L of chlorine ion, and 1 to 1000 mg/L of an additive comprising at least a levelling agent and a brightener. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9445496-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10008452-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11107768-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9615453-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011147059-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10453819-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9686861-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9420707-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019051712-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011057329-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10096565-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9793201-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9642248-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8207453-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011147055-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10070524-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10622310-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9001520-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9761514-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11538763-B2 |
| priorityDate |
1999-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |