| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| filingDate |
1997-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a9596cf61231ca14c0c6369c74ddcc0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e05eb69bfc961438283bfeaa745304fb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c979eb7385c9cec24764a16d3497a2d |
| publicationDate |
1999-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H11186729-A |
| titleOfInvention |
Multilayer printed wiring board |
| abstract |
PROBLEM TO BE SOLVED: To reduce the height of a plated-through hole in a build-up multilayer printed wiring board without deteriorating the electrical connection reliability between the through-hole and the via hole under a high-temperature and high-humidity condition or a heat cycle condition. To realize higher density and higher wiring density. A multilayer printed wiring having a structure in which a conductor circuit is formed on a substrate via an interlayer resin insulating layer, a through hole is provided in the substrate, and the through hole is filled with a filler. In the plate, a conductor layer covering the exposed surface of the filler from the through hole is formed immediately above the through hole, and a via hole is connected to the conductor layer via a roughening layer. The feature is a multilayer printed wiring board. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0111932-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7183497-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7812262-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7514637-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7446263-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2111087-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004235665-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001094264-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7993510-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002050868-A |
| priorityDate |
1997-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |