| abstract |
An implantable microstimulator includes a housing, an electronic subassembly, conductive vias, and an electrode arrangement. The housing defines an interior and an exterior with the electronic subassembly disposed in the interior of the housing. The conductive vias extend from the interior to the exterior of the housing. The electrode arrangement is disposed on the housing and includes a film substrate with electrodes disposed on the film substrate and coupled to the electronic subassembly through the plurality of vias. |