| abstract |
Provided is a microchip manufacturing method by which a functional film is formed in a flow path channel and resin microchip substrates are bonded. The manufacturing method has a first step of forming SiO2 films ( 12, 22 ) representing the functional films on a surface having a flow path channel ( 11 ) of a microchip substrate ( 10 ) and on a surface having a flow path channel ( 21 ) of a microchip substrate ( 20 ) respectively; a second step of exfoliating the SiO 2 films formed on the microchip substrates ( 10, 20 ) except the SiO 2 films formed on the flow path channels ( 11, 21 ) by a cohesive member; and a third step of placing the microchip substrates ( 10, 20 ) one over another in such a way that the surfaces on which the flow path channels ( 11, 21 ) are formed face inside, and bonding the substrates by laser welding, ultrasonic wave welding or thermocompression bonding. |