Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f79cabcbf6b29ccba3cb0ff9a4b416c |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-517 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28264 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28255 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-51 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28017 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02164 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31662 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28211 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02052 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311 |
filingDate |
2007-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2010-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d4d1052dc40b039589da2389962ea29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a79ca817c10fb3ec1c9ab31c3aec3485 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce7ec3136651c39654a50c2b903323da http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c29d23e8ad0fcb582d99b6ce9335b3d0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95ab37cffd563f29e40c8faaef5c57db |
publicationDate |
2010-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-7851365-B1 |
titleOfInvention |
Methods for preparing semiconductor substrates and interfacial oxides thereon |
abstract |
The invention provides novel methods for preparing semiconductor substrates for the growth of an ultra-thin epitaxial interfacial phase thereon. The invention additionally provides the ultra-thin epitaxial interfacial phase formed on a semiconductor substrate prepared by the methods of the invention. Epitaxiality of the interfacial phase is ensured by maintaining the cleaned semiconductor substrate in a static and inert atmosphere prior to oxidation to form the interfacial phase. Such interfacial phase are useful as capping layers and dielectric layers for semiconductor devices. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109727884-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9418963-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9589801-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013066977-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109727884-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017092725-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9018077-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10615085-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113594234-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113594234-A |
priorityDate |
2006-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |