http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7833695-B2

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a8a9982b1666c54b5bf02d6c944891e4
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-0213
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-04253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-323
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-26
filingDate 2007-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2010-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5c525629d9b50b1e77add540b4b8d8f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c1053853e6155ad2621ecc2e075ec49
publicationDate 2010-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7833695-B2
titleOfInvention Methods of fabricating metal contact structures for laser diodes using backside UV exposure
abstract Methods of fabricating a metal contact structure for a laser diodes are provided, wherein the method comprises providing a UV transparent semiconductor substrate, a UV transparent semiconductor epilayer defining a ridge disposed between etched epilayer edges, the epilayer being disposed over the UV transparent semiconductor substrate, and a UV opaque metal layer disposed over the epilayer ridge, applying at least one photoresist layer (positive photoresist, image reversal photoresist, or negative photoresist) over the opaque metal layer and epilayer edges, and selectively developing regions of the photoresist layer via backside exposure to UV light with the opaque metal layer used as a photolithographic mask.
priorityDate 2007-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004086807-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007007544-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6946390-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5059552-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-3615471-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7012022-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6358672-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005178471-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7061022-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6566274-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004147094-A1
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3084099
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID104727
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412550040
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458431511
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419549006
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419522015
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9863
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559503
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559169
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23939
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID117559
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23938
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID90455
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID935
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419583196
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419558592
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985

Total number of triples: 49.