http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7776808-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9b08b25c894379d82adb27a507deeb0f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3218 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-261 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D11-00 |
| filingDate | 2008-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2010-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2524c32bcbdbbff98ed500d829e1dcd9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2b29cacd69436633c0fb543bac26145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3126d64a051e27ee8a2128707b18784a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8a089b8a3a7eaba5f26652f84843061 |
| publicationDate | 2010-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-7776808-B2 |
| titleOfInvention | Cleaning agent for removing solder flux and method for cleaning solder flux |
| abstract | The present invention provides a cleaning agent for removing the solder flux and method for cleaning the solder flux which exhibit the excellent cleaning property even at the time of cleaning a lead-free soldering flux, a high-melting-point solder flux or the like and, at the same time, exhibits the excellent rinsing property in the rinsing using an alcoholic solvent in a next step. Accordingly, the present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of a glycol compound is below 1 weight % with respect to a total amount of the cleaning agent for removing the solder flux, and sets a content of benzyl alcohol to a value which falls within a range of 15 to 99 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of the glycol compound falls within a range of 1 to 40 weight % with respect to a total amount of the cleaning agent for removing the solder flux. The cleaning agent for removing the solder flux is used for cleaning the lead-free solder flux and the high-melting-point solder flux or the like. |
| priorityDate | 2003-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 321.