Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_23cdd583016d49389292095f9f3e7fc7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ea045973c49c4d976e54efb8b7de0d0d http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4c2f4fc159384054f8a9028a921cb44b http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8d801f03aa1c622d81d30d58ab6c8d90 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3218 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-261 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-26 |
filingDate |
2004-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a2a27652c2c49a8b873f7ca990408e9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f8dee457e0e909c2a8cf4e1d3dc8868 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5281644d6499081b0d7a57e7611835bd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f0d8896216c46f6bc09cc467a46ad17 |
publicationDate |
2006-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2006223732-A1 |
titleOfInvention |
Cleaning agent for removing solder flux and method for cleaning solder flux |
abstract |
The present invention provides a cleaning agent for removing the solder flux and method for cleaning the solder flux which exhibit the excellent cleaning property even at the time of cleaning a lead-free soldering flux, a high-melting-point solder flux or the like and, at the same time, exhibits the excellent rinsing property in the rinsing using an alcoholic solvent in a next step. Accordingly, the present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of a glycol compound is below 1 weight % with respect to a total amount of the cleaning agent for removing the solder flux, and sets a content of benzyl alcohol to a value which falls within a range of 15 to 99 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of the glycol compound falls within a range of 1 to 40 weight % with respect to a total amount of the cleaning agent for removing the solder flux. The cleaning agent for removing the solder flux is used for cleaning the lead-free solder flux and the high-melting-point solder flux or the like. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012082565-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8951954-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010311631-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7776808-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2254981-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2254981-A4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9147530-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8877697-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013096044-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014039545-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008305979-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014061284-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9085751-B2 |
priorityDate |
2003-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |