| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76825
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76826
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-469 |
| filingDate |
2007-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17a8889674c91044d451131e1a43c2b2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57206638f22b4d9100fcac3d3034b991
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8cceade7baf6f90c91b0aecc8480cbd7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7f61dac0b82b38a45582a199404bbc7 |
| publicationDate |
2010-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7750479-B2 |
| titleOfInvention |
Treatment of plasma damaged layer for critical dimension retention, pore sealing and repair |
| abstract |
An interconnect structure and method of fabricating the same in which the critical dimension of the conductive features are not altered by a plasma damaged layer are provided. In accordance with the present invention, a chemically etching dielectric material is subjected to a treatment step which modifies the density of the dielectric material such that the treated surfaces become denser than the bulk dielectric not subjected to the treatment. The treatment step is performed prior to deposition of the noble metal liner. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011101507-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10832950-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013049207-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8105943-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011250751-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8288271-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010025855-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8999734-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8592304-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9018089-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8492170-B2 |
| priorityDate |
2006-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |