http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7723760-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_81ba2c4156354c844d4a8883be561f00 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S165-218 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49396 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-427 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28D15-043 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-028 |
| filingDate | 2007-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2010-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54d5f5e5edcc9be748934f626ab1e7ae http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bce585bc9b73cc388e50662c9b0dc359 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a080ca824b8785683671efca3b7edef3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40b3aba94fdf8d6bedbc9c38551e4e14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88a3b9176c197a74d29c59c57ec518e2 |
| publicationDate | 2010-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-7723760-B2 |
| titleOfInvention | Semiconductor-based porous structure enabled by capillary force |
| abstract | The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (μLHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm 2 ). The operation is dependent upon a unique micropatterened CPS wick which contains up to millions per square centimeter of stacked uniform micro-through-capillaries in semiconductor-grade silicon, which serve as the capillary “engine,” as opposed to the stochastic distribution of pores in the typical heat pipe wick. As with all heat pipes, cooling occurs by virtue of the extraction of heat by the latent heat of phase change of the operating fluid into vapor. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11086081-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020050092-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10659168-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9709324-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010038660-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9042096-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010132404-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011186270-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013000871-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8188595-B2 |
| priorityDate | 2005-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 64.