| abstract |
In a first aspect, a method is provided that includes ( 1 ) forming a first barrier layer over the sidewalls and bottom of a via using atomic layer deposition within an atomic layer deposition (ALD) chamber; ( 2 ) removing at least a portion of the first barrier layer from the bottom of the via by sputter etching; and ( 3 ) depositing a second barrier layer on the sidewalls and bottom of the via within the ALD chamber. Numerous other embodiments are provided, as are systems, methods and computer program products in accordance with these and other aspects. |