| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24926
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12903
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0179
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12514 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D85-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00 |
| filingDate |
2003-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2009-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67c9056829c20c9bfa12f7b6903e2bf1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3749ef4fdfcaffd25f4a36a7eaad26c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a7587b8fc7abc575397594b901c01c1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0172bfd63af922d5f166a221ae3bf172
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e648d9820f08479b3bb7c2238a5266fb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3013fe97275489f363124758302116fa |
| publicationDate |
2009-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7524552-B2 |
| titleOfInvention |
Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer |
| abstract |
To provide a dielectric-layer-provided copper foil or the like for extremely improving the product yield while making the most use of the increase effect of an electric capacity of a thin dielectric layer using the sputtering vapor deposition method. n In the case of dielectric-layer-provided copper foils respectively having a dielectric layer on one side of a copper foil, the dielectric layer 6 is an inorganic-oxide sputter film having a thickness of 1.0 μm or less and formed on the one side of the copper foil in accordance with the sputtering vapor deposition method and the dielectric-layer-provided copper foils for respectively forming a capacitor layer, characterized in that a pit-like defective portion generated on the inorganic-oxide sputter film is sealed by polyimide resin are used. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017117096-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9564270-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9818539-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8274779-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9620291-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10062507-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010271748-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10014113-B2 |
| priorityDate |
2002-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |