| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c999fee6428152a996011d506925c2d7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0023 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J171-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J125-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F12-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2005-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1c3a7380881df3d249afad952be30da |
| publicationDate |
2008-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7342053-B2 |
| titleOfInvention |
Resin composition, adhesive film using the same and multilayer printed circuit board |
| abstract |
Producing a printed circuit board, by coating a resin composition comprising an aromatic cyanate compound having two or more cyanato groups in a molecule and a radical-polymerizable resin on a circuit substrate, photo-curing the resin composition, and thermally curing the photo-cured resin composition to thereby form an insulation layer, affords an insulation layer with improved surface smoothness and excellent dielectric properties. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011056623-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010065315-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8216668-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10513568-B2 |
| priorityDate |
2004-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |