| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_95a96b55d0c0f59d15bac7092248f7ad |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0023 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-10 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 |
| filingDate |
1989-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1991-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea949dc20556a2f8b0a01e2a11874fc0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ec0bf6626a73814d35fcabaa2eb4fde
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51275870cbf1c6cc78b115f6f0b77782 |
| publicationDate |
1991-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-5043184-A |
| titleOfInvention |
Method of forming electrically conducting layer |
| abstract |
A conducting layer such as an additional wiring pattern or an electromagnetic insulation layer is formed on a conducting surface such as of a printed circuit board with an insulating layer being interposed therebetween, by a method which includes the steps of: n (a) providing a liquid thermosetting composition containing an epoxy resin, a curing agent, a polymerizable compound having at least two acrylate or methacrylate groups and a photopolymerization initiator; n (b) applying the composition to the conducting surface to form a coated layer; n (c) irradiating actinic light on the coated layer to polymerize the polymerizable compound and to obtain a solid, thermosetting layer, n (d) heating the thermosetting layer to cure the epoxy resin and to form the insulating layer; and n (e) forming an electrically conducting layer on the cured resin layer. Steps (b) and (c) are repeated until the solid thermosetting layer has a desired thickness. Step (d) may be performed before or after step (e). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7342053-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5350594-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7637008-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7594321-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5965245-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6974775-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007141510-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5582872-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008000674-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005187311-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7524606-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004118604-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5834570-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004124533-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004118594-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004126547-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7371975-B2 |
| priorityDate |
1989-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |