| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6a916e03e9b9d6e2e9655219cd75abb5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S204-07 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-665
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00 |
| filingDate |
2002-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd989ddaf958100ad21b009804f78adb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7775e077fb1f3110370a9c3e84339786
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0cfddd8b3c19d4c5b2915589d280b88e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3fc7bc1053ec83ddd9b9b57f553afa2 |
| publicationDate |
2008-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7323094-B2 |
| titleOfInvention |
Process for depositing a layer of material on a substrate |
| abstract |
An electroplating system ( 30 ) and process makes electrical current density across a semiconductor device substrate ( 20 ) surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. The electrical current density modifiers ( 364 and 37 ) reduce the electrical current density near the edge of the substrate ( 20 ). By reducing the current density near the edge of the substrate ( 20 ), the plating becomes more uniform or can be tailored so that slightly more material is plated near the center of the substrate ( 20 ). The system can also be modified so that the material that plates on electrical current density modifier portions ( 364 ) of structures ( 36 ) can be removed without having to disassemble any portion of the head ( 35 ) or otherwise remove the structures ( 36 ) from the system. This in-situ cleaning reduces the amount of equipment downtime, increases equipment lifetime, and reduces particle counts. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11549192-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9988733-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9752248-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9260793-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9567685-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007215481-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010044236-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10017869-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8575025-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003201190-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010032303-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9822461-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010032310-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8308931-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8858774-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8475636-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9909228-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8475644-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10023970-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7854828-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10920335-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9309604-B2 |
| priorityDate |
1997-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |