| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a0f26a9c2efad3ae086a108f3c04b57d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2898 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate |
2004-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f229652e2b3d474582e05117750503d1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28acc62d3909124c88b24a1c73dd0f53 |
| publicationDate |
2007-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7250310-B1 |
| titleOfInvention |
Process for forming and analyzing stacked die |
| abstract |
In a stacked die integrated circuit structure, the structure can subsequently be tested by removing any packaging material and separating the die from a die paddle and from each other. The separation can involve the use of chemicals or heat, with or without the use of mechanical force. One aspect of the invention includes making use of specifically chosen adhesives to secure the die to the die paddle and to each other, so that any subsequent removal can readily be achieved. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8507323-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015048394-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011031631-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8349700-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8258017-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011045639-A1 |
| priorityDate |
2004-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |