http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7112981-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a0f26a9c2efad3ae086a108f3c04b57d |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2884 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 2004-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2006-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ded0f79882a544910c8a6138ed0c9d0 |
| publicationDate | 2006-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-7112981-B1 |
| titleOfInvention | Method of debugging a 3D packaged IC |
| abstract | In a method of testing a 3D packaged IC, the dies are tested under power by mounting on a specifically designed printed circuit board with a window in it for testing the die sequentially from below using a laser beam tester. The die found not to be defective is partially removed in sequential manner to allow the next higher die to be tested. The partial removal of dies is achieved by grinding a window in them using “ChipUnzip” techniques. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111370340-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007051949-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7250310-B1 |
| priorityDate | 2004-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123 |
Total number of triples: 17.