http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7229896-B2

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_88fc7f9eb617072238851d46591a0c76
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76224
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-762
filingDate 2005-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2007-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2cdeb5405b82f930df46f1cef4fc4606
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9b70c2b1c06dc7c59409204adb2b081
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2aa7a4b78894bca30165104fad7c0fdb
publicationDate 2007-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7229896-B2
titleOfInvention STI process for eliminating silicon nitride liner induced defects
abstract The present invention discloses an improved shallow trench isolation process. A semiconductor substrate having a pad oxide disposed thereon and a pad nitride disposed directly on the pad oxide is provided. A trench is etched, through the pad oxide and the pad nitride, into the semiconductor substrate. A thermal oxide liner is then grown in the trench. A silicon nitride liner is deposited into the trench, wherein the silicon nitride liner covering the pad nitride and the thermal oxide liner has a first stress status. A stress alteration process is performed to alter the silicon nitride liner from the first stress status to a second stress status. A trench fill dielectric having the second stress status is deposited into the trench.
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priorityDate 2005-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 49.