http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7086929-B2

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publicationDate 2006-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7086929-B2
titleOfInvention Endpoint detection with multiple light beams
abstract A chemical mechanical polishing apparatus includes two optical systems which are used serially to determine polishing endpoints. The first optical system includes a first light source to generate a first light beam which impinges on a surface of the substrate, and a first sensor to measure light reflected from the surface of the substrate to generate a measured first interference signal. The second optical system includes a second light source to generate a second light beam which impinges on a surface of the substrate and a second sensor to measure light reflected from the surface of the substrate to generate a measured second interference signal. The second light beam has a wavelength different from the first light beam.
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