| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad954b1707d771a72854b169c84da03e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0174
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0235
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-042 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B26-0841
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00182 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B26-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate |
2003-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10032ee490eb4b4f15887c261615f63f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d448804d662be8812179cdf2a32eacb0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9decf0860c207c3a1b8aa68379284814
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6257ded1aca2e4831e776d48c82e7145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55ad5adb6500611170e20becb22d4c84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9c80b197b65051936b07ba129043f83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_495cfb9bfb1965db5d90f5e82d7cfceb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_850c362cb03a324e3f6102800cb7decb |
| publicationDate |
2006-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7033515-B2 |
| titleOfInvention |
Method for manufacturing microstructure |
| abstract |
A method is for manufacturing a microstructure having a thin-walled portion with use of a material substrate. The material substrate has a laminated structure which includes a first conductor layer 101 , a second conductor layer 102 , a third conductor layer 103 , a first insulating layer 104 interposed between the first conductor layer and the second conductor layer, and a second insulating layer 105 interposed between the second conductor layer and the third conductor layer. The first insulating layer is patterned to have a first masking part for covering a thin-wall forming region of the second conductor layer. The second insulating layer is patterned to have a second masking part for covering the thin-wall forming region of the second conductor layer. The method includes forming the thin-walled portion in the second conductor portion by etching the material substrate from the first conductor layer down to the second insulating layer via a mask pattern 58 including a non-masking region corresponding to the thin-wall forming region of the second conductor layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015060405-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9263162-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7855151-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007052106-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009107949-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8142670-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007022827-A1 |
| priorityDate |
2002-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |