| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_30568c6ab6cbc54250977463ccc678f7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1089 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76886
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-4763
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-14 |
| filingDate |
2004-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21cf31588f6cae99a5a566083f703405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e07e495b1605ab4203f8738b0ef96ef7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6710017c01a3d52d48a1c7f40109801 |
| publicationDate |
2006-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7022598-B2 |
| titleOfInvention |
Method of producing multilayer interconnection structure |
| abstract |
A method of producing a buried-type multilayer interconnection structure is provided. The method comprises steps of: forming a hole portion in an insulating layer; forming a catalyst layer having average film thickness from 0.2 nm to 10 nm on a surface of the hole portion by a physical vapor deposition method; forming an electroless plating layer on the surface of the hole portion by an electroless plating method using the catalyst layer as a catalyst; and burying up the hole portion with an electrolytic plating layer by an electrolytic plating method using the electroless plating layer as a seed layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006105570-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009186482-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7838423-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7799683-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007066081-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7291558-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007184655-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006052958-A3 |
| priorityDate |
2003-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |