| abstract |
Disclosed is a semiconductor package which has no resinous flash formed on a lead frame and its manufacturing method. The method includes the steps of preparing a lead frame having a first surface and a second surface, attaching an adhesive tape capable of being easily removed on the second surface of the lead frame, attaching a first semiconductor chip on the lead frame and electrically connecting the first semiconductor chip with the lead frame, performing a molding process to form a resin molded block on the first surface of the lead frame for covering the first semiconductor chip, removing the adhesive tape, attaching a second semiconductor chip on the second surface and electrically connecting the second semiconductor chip with the lead frame, attaching a frame with a hollow portion on a predetermined position of the second surface of the lead frame by an adhesive agent and containing the second semiconductor chip in the hollow portion, and bonding a covering member on the frame to seal the hollow portion for isolating the second semiconductor chip from outside. |