Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5bfefd800f38f5e22f9b809a498f78ed |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-097 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0154 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1433 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0264 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0792 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19105 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-148 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-142 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-0061 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3135 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-0069 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-0627 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00309 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-143 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4821 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-0084 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L13-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49541 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L19-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L13-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 |
filingDate |
2018-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2020-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2047b654b6e32ab299080226a47e089 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4590672fb5140063aa519a82e0f03680 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62fa1c1cc9dd51675ae863eb9882ff3a |
publicationDate |
2020-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-10830656-B2 |
titleOfInvention |
Overmolded lead frame assembly for pressure sensing applications |
abstract |
A process of forming an overmolded lead frame assembly for a pressure sensing application includes clamping both sides of a lead frame to performing a primary overmolding operation to prevent resin flash on wire bonding areas on the lead frame. The process also includes performing the primary overmolding operation to form a primary mold that covers selected portions of the lead frame on first and second sides of the lead frame assembly. The primary mold forms an electronics cavity on the first side of the lead frame assembly to enable subsequent wire-bonding of a microelectromechanical system (MEMS) pressure sensing element to the wire bonding areas. The process further includes performing a secondary overmolding operation to form a secondary mold on the second side of the lead frame assembly. The secondary mold covers an exposed portion of the lead frame beneath the wire bonding areas. |
priorityDate |
2018-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |