| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36c0172f6059c0b200188dba42db7fa6 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76807
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
1999-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2003-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82fbb83cf579681928f70e0559d80026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecd0c4b10d5a0c074c81d88c796ba166 |
| publicationDate |
2003-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6660636-B1 |
| titleOfInvention |
Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating |
| abstract |
A novel method for the activation of semiconductor substrates for highly selective electroless copper plating in multilayer interconnect metallization lines and vias/contact holes has been developed. A copper-seeded polysilicon layer is provided over the substrate to facilitate growth of copper into the vias. Subsequent rinsing and chemical-mechanical polishing processes allow removal of overgrowth of copper and the polysilicon layer to achieve overall smooth topography of the copper surface and the insulating layer surface of the substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7906272-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009181543-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8779596-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100640600-B1 |
| priorityDate |
1998-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |