http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100640600-B1

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
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filingDate 2004-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2006-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2006-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100640600-B1
titleOfInvention Slurry composition and method for manufacturing semiconductor device including chemical mechanical polishing process using same
abstract An exemplary embodiment of the present invention provides a new slurry composition that can be used in a process involving chemical mechanical polishing of a polysilicon layer. The slurry composition may comprise one or more nonionic polymers capable of selectively forming a passivation layer on the exposed polysilicon surface to reduce polysilicon removal rates and to improve the flatness of the polished surface for silicon oxide and silicon nitride. Surfactants. Typical surfactants include alkyl and aryl alcohols consisting of ethylene oxide (EO) -propylene oxide (PO) block polymers, which may be effective in smaller amounts but present in slurry compositions in amounts up to 5 Wt%. Other slurry additives include viscosity modifiers, pH adjusters, dispersants, chelating agents, and amine or imine surfactants to control the relative removal rates of silicon nitride and silicon oxide.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101210125-B1
priorityDate 2003-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 50.