| abstract |
A technique for forming a film of material ( 12 ) from a donor substrate ( 10 ). The technique has a step of introducing energetic particles ( 22 ) in a selected manner through a surface of a donor substrate ( 10 ) to a selected depth ( 20 ) underneath the surface, where the particles have a relatively high concentration to define a donor substrate material ( 12 ) above the selected depth and the particles for a pattern at the selected depth. An energy source such as pressurized fluid is directed to a selected region of the donor substrate to initiate a controlled cleaving action of the substrate ( 10 ) at the selected depth ( 20 ), whereupon the cleaving action provides an expanding cleave front to free the donor material from a remaining portion of the donor substrate. |