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filingDate 2002-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2003-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2003-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-6575823-B1
titleOfInvention Polishing pad and method for in situ delivery of chemical mechanical polishing slurry modifiers and applications thereof
abstract The present invention is directed, in general, to polishing pads for chemical mechanical polishing of semiconductor wafers and integrated circuits. More specifically, the invention is directed to polishing pads containing a precursor slurry modifier. In the presence of a polishing slurry during chemical mechanical polishing, the precursor is released to the polishing slurry to form a slurry modifier thereby improving polishing.
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