| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_65aa22bcc8da87a6c99b46e5dc8b28eb |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate |
2001-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2002-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11f5b0b79e9184ad9f53a92b465e369e |
| publicationDate |
2002-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6475702-B2 |
| titleOfInvention |
Photosensitive resin composition and photoresist ink for manufacturing printed wiring boards |
| abstract |
A photosensitive resin composition developable with water or a diluted alkali solution comprises the following components (A) to (D). That is, the component (A) is a water-soluble photosensitive resin selected from the group consisting of a first resin obtained by introducing a styryl pyridinium group into a polyvinyl alcohol polymer, a second resin obtained by introducing a styryl quinolinium group into the polyvinyl alcohol polymer, and a third resin obtained by adding N-alkylol(meth)acrylamide to the polyvinyl alcohol polymer. The component (B) is a photosensitive prepolymer having a carboxyl group and at least two ethylenically unsaturated groups in molecule. The component (C) is a photopolymerization initiator. The component (D) is water. The photosensitive resin composition will be preferably used as a photoresist ink for manufacturing printed wiring boards. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006134245-A1 |
| priorityDate |
1998-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |