| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54453
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13099 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-544 |
| filingDate |
2000-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2002-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba7ae19d2ad01cae6c6141d4c9501aae
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f7d4aabb66946204e999c3232c8ba7d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32f8e0b9b483e157eaef6ba8d5f11353 |
| publicationDate |
2002-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6350680-B1 |
| titleOfInvention |
Pad alignment for AlCu pad for copper process |
| abstract |
A new method is provided for the alignment of the patterning of AlCu pads in an environment of copper interconnect line patterns. A layer of passivation material is deposited over a surface that contains alignment marks. The layer of passivation is patterned creating in the surface of the layer of passivation the opening that is required for the AlCu pad in addition to openings for a new pattern of alignment marks. A layer of AlCu is sputter deposited over the surface of the layer of passivation thereby including the openings that have been created in the layer of passivation. This creates a new pattern of alignment marks in the surface of the deposited layer of AlCu whereby these new alignment marks align with the pattern of new alignment marks that has been etched in the layer of passivation. The new alignment marks are then used to pattern the layer of AlCu for the creation of the AlCu pad. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006199088-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007080460-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004175918-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I458073-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7646097-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004259322-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6908830-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7583834-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003109113-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8324731-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6841408-B2 |
| priorityDate |
2000-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |