| abstract |
A destaticizing thermoplastic resin composition compristing (A) a thermoplastic resin; (B) a polymer having a surface resistivity measured at 500 V of 108 to 1011 OMEGA , a melting point of 100 DEG C. or higher, an apparent malt viscosity at an apparent shear rate at 260 DEG C. of 1,000 sec-1 of 10 to 1,000 Paxs, and a ratio of the above apparent melt viscosity to the apparent melt viscosity of the thermoplastic resin at an apparent shear rate at 260 DEG C. of 1,000 sec-1 of 0.01 to 1.3; or a carbon fiber having a diameter of 1 nm to 1 mu m, a length of 1 mu m to 10 mm and a volume resistivity of less than 1 OMEGA cm; or a combination of the polymer and the carbon fiber; and (C) a fibrous conductive filler having a volume resistivity of 100 OMEGA xcm or less. The destaticizing composition is useful for preparation of a carrier jig for use in an electronic field. |