| abstract |
PCT No. PCT/JP96/01621 Sec. 371 Date Dec. 15, 1997 Sec. 102(e) Date Dec. 15, 1997 PCT Filed Jun. 13, 1996 PCT Pub. No. WO97/00534 PCT Pub. Date Jan. 3, 1997An object is to peel off a disused resist from an article, e.g., a silicon wafer, with an adhesive sheet while preventing impurities contained in the adhesive sheet from transferring to the surface of the article, e.g., wafer, and from thus arousing electrical troubles resulting in problems such as decreases in the yield and reliability of the article. A method for resist removal comprising forming an adhesive layer on an article on which a resist is present and peeling the adhesive layer as a united sheet including the resist material from the article, characterized in that the adhesive layer has been regulated so as to have a modulus of elasticity of 1 Kg/mm2 or higher in the peeling, and an adhesive or an adhesive sheet both for use in the method. |