| abstract |
The present invention relates to a silicone pressure-sensitive adhesive composition which cure upon exposure to ambient moisture. The moisture-curable silicone pressure-sensitive adhesive composition of the instant invention comprise: (A) an organopolysiloxane resin containing curing radicals of the formula -SiY2ZNY'ZSiR1xY''3-x wherein R1 is a monovalent hydrocarbon radical, each Z is a divalent linking group, each Y is independently selected from the group consisting of a monovalent organic radical, an enoloxy radical, an alkoxy radical, and an oximo radical; Y' is selected from the group consisting of a monovalent organic radical, a hydrogen atom, and -ZSiR1xY''3-x; Y'' is selected from the group consisting of an enoloxy radical, an alkoxy radical, and an oximo radical; and the subscript x has a value of 0 or 1; (B) a diorganopolysiloxane polymer, each terminal group thereof containing at least one silicon-bonded hydrolyzable functional radicals selected from the group consisting of hydroxyl radicals, alkoxy radicals having 1 to 4 carbon atoms, ketoxime radicals, enoloxy radicals, aminoxy radicals, acetamido radicals, N-methylacetamido radicals and acetoxy radicals; said polymer having a viscosity at 25 DEG C. of 20 to <100,000 mm2/s and the weight ratio of said resin to said polymer being in the range 5:95 to 90:10; (C) optionally, sufficient catalyst to accelerate the cure of said composition; (D) optionally a silane of the formula R24-ySiXy or oligomeric reaction product thereof, in which R2 is selected from the group consisting of hydrocarbon radicals and substituted hydrocarbon radical having 1 to 6 carbon atoms, X is a hydrolyzable group and y is 2 to 4; and (E) optionally, a filler. |