abstract |
A phenolic resin molding material comprising a phenolic resin, an organic filler, an inorganic filler and a liquid substance having a boiling point of 80°-150° C., said phenolic resin comprising, as its main component, a novolac type phenolic resin wherein the ratio of the o-methylene bond to the p-methylene bond with respect to the phenol nucleus ranges from 1.0 to 2.5. |