| abstract |
The invention is directed to a method for forming a metal coating on a substrate by applying an oxalate of a Group VIII element from the Periodic Table of the Elements to the substrate. The oxalate is selected so that it will decompose to a complex of a zero valent Group VIII element or a Group VIII element on exposure to an energy source. Microelectronic circuits, etch masks or metal contacts on superconductors can be formed by the method when the oxalate coating is exposed to an energy source through a mask or the energy source beamed at the oxalate to trace a pattern on it. n The metal thus obtained can be subsequently coated by electroless compositions especially where the Group VIII element is a catalyst for electroless coatings such as palladium. Additionally, the metal coating may be coated by an electrolytic composition. n Through hole plating can also be achieved by applying the oxalates of a Group VIII element in the through hole of a circuit board followed by exposure to an energy source optionally followed by the application of an electroless and/or electrolytic metal composition. |