abstract |
A curable adhesive composition is disclosed, comprising a polymerizable prepolymer, a reactive diluent, and a polymerization initiator, wherein said composition further comprises an inorganic filler and/or a (meth)acrylate having an isocyanurate ring. n The adhesive composition of the invention is curable by the action of heat or light and is extremely useful as an adhesive for surface mounting devices. |