| abstract |
A composition comprising (A) an epoxy resin having at least two epoxy groups in a molecule, (B) a silicone-modified epoxy resin, (C) an imidazole curing agent having a solubility of up to 0.1% by weight in epoxy resin (A) at 25 DEG C., and (D) fused silica having a mean particle size of up to 10 mu m and adjusted to a viscosity of up to about 4,000 poise at 25 DEG C. satisfies the requirements for flip chip encapsulation since the composition has improved shelf stability and filling ability and cures into products having improved moisture resistance. Semiconductor devices encapsulated with cured products of the composition remain reliable because of moisture resistance. |