| abstract |
When a semiconductor chip is mounted on a circuitnsubstrate, the space therebetween can be rapidly sealed withna resin encapsulant by transfer molding an encapsulatingnresin composition in molten state and under pressure intonthe space and heat curing the composition thereat. Thencomposition contains (a) an epoxy resin, (b) a curing agent,nand (c) an inorganic filler having a maximum particle sizenof up to 24 µm and has a melt viscosity of up to 200 poisesnat the molding temperature. Then encapsulation can bencompleted within a very short cycle without allowing thenfiller to settle. Semiconductor devices are manufactured tonhigh reliability. |