| abstract |
This invention discloses a curing resin composition comprising (a) an organic resin containing no less than 2 alkenyl groups per molecule, and having a number average molecular weight of 500-100,000. (b) an organohydrogen-polysiloxane containing no less than 2 Si--H bonds per molecule, and (c) a platinum catalyst. It is desired that the organic resin of component (a) is at least one type chosen from acrylic, polyester and epoxy. The preferable amount of component (b) is such that there are 0.8-4 hydrogen atoms bonded to silicon atoms per alkenyl group of component (a). |