| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_676b80da7ac92b84e447a83fb1630ae1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_21b4c5ce8e9bcc3be553de0ed80de6c9 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0226 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-36 |
| filingDate |
1990-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1992-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7a76c36940116f1c8163640eaddaf2c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a5b13a53d8c5931415ca8fd385a12ea
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ebc069d4b2e33acca64b19f51c60e224
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f2cf5591ff31050276b212127a9ae70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1cf8db4252b958726afacf09e3a6c0b4 |
| publicationDate |
1992-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-5114827-A |
| titleOfInvention |
Photoresists resistant to oxygen plasmas |
| abstract |
The invention is a modified organic photoresist which is resistant to etching in oxygen-containing plasmas and therefore particularly useful for masking and etching organic polymer materials in VLSI and advanced packaging applications. The invention comprises adding a phosphorous-containing compound to a conventional photoresist. The phosphorous-containing compound is of a type and in an amount effective to substantially prevent etching of the modified photoresist in an oxygen-containing plasma without substantially adversely affecting the photosensitivity of the photoresist or the elasticity or the adhesion of the etch resistant film formed during oxygen-containing plasma exposure to an underlying material to be patterned and etched. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7943406-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7338822-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7943954-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008185680-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005194584-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5633111-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7592634-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005285126-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009104726-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018339901-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006108595-A9
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005029533-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009309124-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5393642-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7723201-B2 |
| priorityDate |
1988-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |