| abstract |
A room temperature vulcanizable organopolysiloxane composition comprising a diorganopolysiloxane blocked with a hydroxyl group at opposite ends of the molecular chain of the diorganopolysiloxane, a silane or siloxane compound having at least three hydrolyzable groups in the molecule, a filler, and a curing catalyst. The composition further comprises a specific type of amide compound whereby the composition is readily released from electric or electronic parts after having been vulcanized and dipped in a hot soldering bath. |