| abstract |
An integrated semiconductor structure including the fabrication thereof, and more particularly, an improved means for interconnecting the two planar surfaces of a semiconductor wafer. To provide the electrically conductive interconnections through the wafer, a hole is etched, insulated, and metallized. Active or passive devices may be formed on either or both sides of the wafer and connected to a substrate by solder pads without the use of beam leads or flying lead bonding. |