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filingDate 2022-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2022-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2022208544-A1
titleOfInvention Method of manufacturing semiconductor device, substrate processing method, non-transitory computer-readable recording medium and substrate processing apparatus
abstract According to one aspect of a technique of the present disclosure, there is provided a method of manufacturing a semiconductor device, including: (A) forming a film containing a predetermined element and nitrogen on a substrate by performing a cycle a predetermined number of times, wherein the cycle includes: (a) forming a first layer by supplying a source gas containing the predetermined element and a halogen element to the substrate heated to a first temperature; (b) forming a second layer by modifying the first layer by supplying a plasma-excited first modification gas containing hydrogen free of nitrogen; and (c) forming a third layer by modifying the second layer by supplying a plasma-excited second modification gas containing nitrogen and hydrogen. A supply time TH of supplying the first modification gas in (b) is set to be longer than a supply time TN of supplying the second modification gas in (c).
priorityDate 2019-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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