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filingDate 2021-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2022-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2022157826-A1
titleOfInvention Semiconductor structure manufacturing method and semiconductor structure
abstract Provided are a semiconductor structure manufacturing method and a semiconductor structure. The semiconductor structure manufacturing method includes: a substrate is provided, which includes a first area and a second area set adjacent to each other; multiple trenches, which are arranged at intervals along a first direction, are formed in both the first area and the second area of the substrate; a word line (WL) is formed in each of the multiple trenches, a feature size of the WL in the first area is different from that of the WL in the second area; and a contact structure is formed on the WL with the greater feature size.
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