| abstract |
The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 μm or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 40% by mass and less than 80% by mass. The sinter-bonding sheet ( 10 ) has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet ( 10 ) and a dicing tape ( 20 ). The dicing tape ( 20 ) has a lamination structure containing a base material ( 21 ) and an adhesive layer ( 22 ), and the sinter-bonding sheet ( 10 ) is positioned on the adhesive layer ( 22 ) of the dicing tape ( 20 ). |